JIERUYIIX5 Ultra Universal Preheating Platform Mobile Phone Motherboard Layered Bonding Glue Removal Dot Matrix Repair Heater

Name: JIERUYIIX5 Ultra Universal Preheating Platform Mobile Phone Motherboard Layered Bonding Glue Removal Dot Matrix Repair Heater
Price: 28729.00 JPY
Availability: InStock

Product ID: 648394445

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JIERUYIIX5 Ultra Universal Preheating Platform Mobile Phone Motherboard Layered Bonding Glue Removal Dot Matrix Repair Heater

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TrustScore 4.5 | 7,300+ reviews

Rajesh P.

Customer service was outstanding when I had questions about the product.

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