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🖥️ Protect your powerhouse—bend no more, build like a pro!
The Thermalright LGA1700 Anti-Bending Buckle is a precision-engineered aluminum alloy backplate designed to prevent CPU bending in Intel 12th and 13th generation processors. Featuring original LOTES insulation pads and a slim 54x70x6mm profile, it offers trace-free, durable protection with an easy one-step installation using the included L-shaped screwdriver. Ideal for professionals seeking to maintain optimal CPU integrity and build aesthetics.





| ASIN | B0B5Q34SZ1 |
| Best Sellers Rank | #13,834 in Computers ( See Top 100 in Computers ) #943 in Internal Components |
| Brand Name | Thermalright |
| Compatible Devices | Desktop |
| Cooling Method | Air |
| Customer Reviews | 4.8 4.8 out of 5 stars (1,385) |
| Included Components | 1 |
| Item Dimensions L x W x H | 5.4L x 0.6W x 7H centimeters |
| Item Weight | 100 Grams |
| Manufacturer | Thermalright |
| Material Type | Metal |
| Model | LGA 17XX-BCF-BLACK-D1-G3 |
| Number of Items | 1 |
| Part Number | LGA 17XX-BCF-BLACK-d1-G2 |
| Power Connector Type | 4-Pin |
| UPC | 796520302679 796520302563 |
| Unit Count | 1 Count |
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