Description
- CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered with CS-FLUX and durring reflow or removal of the BGA componets all PCB and componet pads and balls are protected.
- CS-FLUX is no clean flux and causes no corrosion if not cleaned but it can be cleaned easily with alcohol.
- Thank's to it's liquid nature, a very small amount of CS-FLUX is needed for each repair resulting in a much cleaner work enviroment.
- CS-FLUX is very sticky and specially designed to keep the solder balls inside the stencil durring the reballing proccess. It is also ideal for reflow of BGA components (with heatgun) when needed equipment for reballing is not avaliable.
- CS-FLUX is produced in EU (Greece) and will be shipped to your workshop very fast.
CS-FLUX reballing Low viscosity Halogen-free liquid flux for BGA component rework reflow 10g . Ideal for VGA GPU repairs
