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100% brand new and high quality Features: The multi-purpose stencil basically covers the current common BGA chip. Can be heated by air gun, stencil is not easy to deform by heat. The mesh design can reduce the waste of solder ball. Simple and convenient to use. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh.Durable in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Specification: Material: Metal Color: Sliver Size: app.195mmx10mm/7.68x3.94in(LxW) Quantity: 5 Pcs Note: No retail package Transition: 1cm=10mm=0.39inch Please allow 0-1cm error due to manual measurement, please make sure you do not mind before you bid. Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package includes: 5 Pcs x Reballing Stencil
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1 week ago
1 week ago